Product Descriptions

HDI (High Density Interconnect) PCB Specification

  • ■ ADVANTAGE
  • · Elimination of signal interference in adjacent circuits
  • · Design space constraints resolved
  • · Ground space maximized(Noise decreased)
  • · Wiring length reduced(Signal delay reduced)
Layer 4L~12L
Thickness 0.8T~1.6T
Width & Space Min. 3/3mil
Material Mid-Tg, Halogen Free
PTH Φ0.25
Special Requirement · Buried, Blind, Micro-via
· Hole Pluggin
  • ■ APPLICATION
  • · Mobile Smart Phone(Main Board, LCD)
  • · Digital Camera(Main Board, LCD)
  • · Etc : Navigation, AVR

THE PRODUCT PICTURE